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| LQFP Low Profile Quad Flat Pack * 7 x 7mm to 28 x 28mm body sizes * 32 to 208 lead counts * Lead pitch range from 0.80mm to 0.40mm FEATURES * Body Sizes: 7 x 7mm to 28 x 28mm * Package Height: 1.4mm * Lead Counts: 32L to 208L * Lead Pitch: 0.80mm to 0.40mm * Wide range of open tool leadframe and die pad sizes available * Moisture Sensitivity: JEDEC Level 3 * JEDEC standard compliant * Lead-free and Green materials sets available * Copper and alloy leadframes available DESCRIPTION STATS ChipPAC's LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs with high I/Os while meeting low profile requirements and for mainstream cost sensitive applications. APPLICATIONS * 3D Graphics * Multimedia * PC Chipsets * Video / Audio * Telecom * Disc Drives * Communication Boards (Ethernet, ISDN) www.statschippac.com LQFP Low Profile Quad Flat Pack SPECIFICATIONS Die Thickness Gold Wire Lead Finish Marking Packing Options 280-430m (11-17mils) range preferred 25/30m (1.0/1.2mils) diameter, 99.999%Au 85/15 Sn/Pb or Matte Tin Laser / ink JEDEC tray / tape and reel RELIABILITY Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Liquid Thermal Shock (opt) JEDEC Level 3 -65C/150C, 1000 cycles 150C, 500 hrs 121C 100% RH, 2 atm, 168 hrs -55C/125C, 1000 cycles THERMAL PERFORMANCE, ja (C/W) Package 48L 100L 208L Body Size (mm) 7 x 7 x 1.4 14 x 14 x 1.4 28 x 28 x 1.4 Pad Size (mm) 5.3 x 5.3 9.0 x 9.0 9.0 x 9.0 Die Size (mm) 3.8 x 3.8 7.8 x 7.8 7.8 x 7.8 Thermal Performance, ja (C/W) 50.0 37.2 32.1 Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2. ELECTRICAL PERFORMANCE Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Lead (7 x 7mm, 32L) Total (7 x 7mm, 32L) Wire Lead (14 x 14mm, 128L) Total (14 x 14mm, 128L) 2 3.0 - 4.5 Length (mm) 2 1.4 - 2.2 Resistance (mOhms) 120 11.0 - 18.0 131 - 138 120 24.0 - 36.0 144.0 - 156.0 Inductance (nH) 1.65 0.64 - 0.99 2.29 - 2.64 1.65 1.96 - 2.92 3.61 - 4.57 Inductance Mutual (nH) 0.45 - 0.85 0.31 - 0.49 0.76 - 1.34 0.45 - 0.85 1.08 - 1.61 1.53 - 2.46 Capacitance (pF) 0.10 0.21 - 0.33 0.31 - 0.43 0.10 0.45 - 0.67 0.55 - 0.77 Capacitance Mutual (pF) 0.01 - 0.02 0.07 - 0.12 0.08 - 0.14 0.01 - 0.02 0.20 - 0.30 0.21 - 0.32 CROSS-SECTION PACKAGE CONFIGURATIONS Package Size (mm) 7x7 10 x 10 12 x 12 14 x 14 14 x 20 20 x 20 24 x 24 28 x 28 Lead Count 32, 40, 48 44, 64 80, 100 44, 64, 80, 100, 128 128 144,184 176 208 Corporate Office Global Offices 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 JAPAN 81-43-351-3320 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. (c)Copyright 2005. STATS ChipPAC Ltd. All rights reserved. January 2005 |
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